We think you'll enjoy this article published by Future Fab International, written by David Lam.
A Different Way to Look at EBL
The semiconductor industry often expects a new, "next-generation" technology to solve all the problems, meet all mainstream performance metrics, and replace the old technology instantly and completely when making its debut.
Historically, there were indeed "plug and play" new technologies in front-end processing: proximity printing (replacing contact printing), 4x reduction optics for lithography (replacing 1x), plasma etching (replacing liquid chemical etching), copper interconnect (replacing aluminum), to name just a few.
While technology obsolescence is a fact of life in our industry, some new technologies co-exist with and complement the old rather than replace it right away - or ever....
1D Layout, Complementary Lithography, and CEBL
To enable manufacture of advanced logic devices, mainstream fabs are moving from conventional 2D layout style to the highly regular 1D layout style. The 1-D layout pattern is manufacturable today and extendable into the future. It is the ultimate form of proactive DFM....
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About Multibeam Corporation
Santa Clara, California, Multibeam
Corporation is a leading developer
of multi-column e-beam technologies
that add high value to semiconductor
lithography by doing away with
costly masks. The company's
Complementary E-Beam Lithography (CEBL)
system augments optical lithography
at critical layers by eliminating
expensive optical multiple
patterning at 20nm processing nodes
and beyond. Multibeam's systems can
also be cost-efficiently leveraged
as primary lithographic tools for
low-volume production of ASICs as
well as in multi-project wafer
patent-protected e-beam technologies
encompass deployment of multi-column
arrays to perform wafer inspection. For more information, visit
Media Contact: Tom Rigoli,
Vice President, Multibeam
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