Electron beam lithography (EBL) has a proven track
record: e-beam systems have been used for some 30
years to produce photomasks for optical lithography
in semiconductor manufacturing. However, EBL has a
major problem: it is extremely slow.
Multibeam Corporation has a solution: an innovative
and proprietary multi-column e-beam technology that
dramatically increases wafer throughput and reduces
the cost of lithography.
Multibeam achieves high throughput by optimizing the
e-beam column for Complementary E-Beam Lithography (CEBL),
building an array of identical columns, and
combining several column-array modules into a
cluster tool.
Multibeam is the technology leader in multi-column
EBL, with 22 patents (15 issued). Multibeam’s CEBL
complements and extends optical lithography,
drastically reducing the cost of patterning critical
layers at advanced technology nodes in HVM.
The same multi-column technology also works for
low-volume production
of ASICs, wafer defect inspection and other
applications.
Multibeam Corporation is led by Dr. David K. Lam,
founder and former CEO of Lam Research Corporation.
