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TEL to Enter Maskless Litho Business  
  EE Times  

SEMICON West 2009  
  Moscone Center San Francisco
Jul 14-16, 2009
 

SPIE Photomask / BACUS  
  Monterey California
Sep 14-18, 2009
 
     

   

Technical Papers  
     
 
     
     
 

 

   

 

   
 
 

Headquartered in Santa Clara, CA, Multibeam Corporation is headed by David Lam, CEO, and N. William Parker, CTO.

As the leader in multi-column e-beam technology, Multibeam holds a substantial IP portfolio. Multibeam’s e-beam column, the MBX
Ô Engine, is capable of extraordinary writing speeds, making it a viable solution to the lithography challenges facing the semiconductor industry at the 22nm node.

 

Multibeam is developing complete multi-column e-beam lithography systems, the MEBICÔ line, for low-volume production of ASICs.  In addition to the MEBICÔ, the company develops custom e-beam columns for OEMs.

Multibeam Team

Multibeam has assembled a world-class engineering team to develop our electron beam system. Multibeam's management team has a track record of success in leading the development and production of semiconductor manufacturing equipment.
  • David Lam - CEO
  • N. William Parker - CTO
Find out more about our executives.

E-Beam History
  • 1935: First Scanning Electron Microscope (SEM) image
  • 1970s to 1980s: E-beam Direct Write (EBDW) produced ICs for use in mainframe computers.
  • 1980s to today: E-beam mask writers are used to pattern photomasks.
  • 1999: Scalpel (ASML, Applied Materials, Lucent)
  • 2001 to today: Multibeam develops and refines multi-column e-beam technology and systems.

Multibeam Milestones

  • 2004-2006: NIST sponsored EBDW project at Multibeam
  • 2007-2009: Multibeam develops high volume e-beam column with OEM customer.
  • Apr 2008: David Lam becomes CEO
  • Jan 2009: Multibeam moves to new headquarters

Technology

Multibeam e-beam columns are all-electrostatic, enabling small column footprint and fast slew rates. Each column includes a TFE electron source and incorporates unique beam-shaping technologies to achieve high current density at the wafer.  Columns are independently controlled and functioning, each acting as an individual e-beam lithography system.

By combining multiple e-beam columns into an array, our MBX
Ô Engines are capable of achieving speeds that are orders of magnitude higher than single beam systems.