Multibeam News  
July 2017
David K Lam presents at Semicon
May 2017
Multibeam Secures $35M Defense Contract to Build E-Beam System
November 2016
SST article: Multibeam Patents Direct Deposition and Etch
September 2016
eBeam Initiative Tech Talk video:
Embedding IoT Chip Security using eBeam Solutions
July 2016
Ed Sperling, Semi. Engineering interview of David K Lam: Securing Chips During Manufacturing
June 2016
GSA Forum: Reducing IC Cost While Enhancing IoT Security
November 2015
Multibeam Opens New Headquarters
CEBL Solutions



Multibeam builds arrays of e-beam columns. Each array deploys approximately 100 columns (for 300mm wafers). A wafer is positioned under the array, and all columns pattern the wafer simultaneously. To achieve high throughput, multiple patterning modules are combined into a cluster system. For more details on how CEBL can meet both high-volume and low-volume requirements, see Applications. 





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