Multibeam’s Complementary E-Beam Lithography (CEBL)
technology is capable of high resolution and high
throughput.
Multibeam achieves high throughput with its
innovative all-electrostatic
column technology and
multi-column architecture. The elimination of the
magnetic coil makes the column footprint very small.
In the absence of magnetic fields (and hysteresis),
the e-beam is deflected at very high speeds
for
alignment, blanking, shaping, focusing and
positioning.
Electrons are accelerated out of an
industry-standard electron emitter and steered into
the column. The shaped beam, which is blanked on and
off, is focused onto the wafer surface by the main
lens. Positioning the beam at the wafer is a
two-step vector-scanning process: a mainfield
deflector positions
the beam at a subfield; then a
subfield deflector rapidly vector scans the
beam to
write patterns.
Multibeam's technology has several competitive
advantages. Each column is individually
auto-calibrated and patterns wafers with high
overlay accuracy.
Each beam is vector scanned,
skipping over empty areas with no patterns,
resulting in higher throughput. Every column is
identical, leading to lower-cost manufacturing and
higher reliability.
Multibeam builds arrays of e-beam columns. Each
array has approximately
100 columns (for 300mm
wafers). A wafer is positioned under the array, and
all columns pattern the wafer simultaneously. To
achieve high throughput, multiple patterning modules
are combined into a cluster system.
“Multibeam optimizes a single column before
building an Array of identical columns. A module
with a single column array is capable of
patterning
5 wafers/hour. Multibeam collaborates with an
established
equipment manufacturer to build CEBL
cluster tools for high-volume manufacturing”.
Contact us today.
Submit your Request for Proposal.
