Multibeam’s CEBL technology achieves high
throughput and resolution with a multi-column array of
electrostatically controlled e-beams. Eliminating
cumbersome electromagnetic control radically shrinks
column footprints. Absence of magnetic fields (and
hysteresis) enables e-beams to be deflected at very high
speeds for alignment, blanking, shaping, focusing and
positioning. While a mainfield deflector first positions
the beam at a subfield; a subfield deflector then
rapidly vector scans the beam to write patterns.
“Multibeam optimizes a single column before
building an Array of identical columns. A module
with a single column array is capable of
5 wafers/hour. Multibeam collaborates with an
equipment manufacturer to build CEBL
cluster tools for high-volume manufacturing”.
CEBL offers compelling advantages as
each column is individually auto-calibrated and
patterns wafers with high overlay accuracy. Vector
scanning boosts throughput by skipping over areas
without patterns. Each column is identical, leading
to lower-cost manufacturing and higher reliability.
Multibeam collaborates with an established equipment
manufacturer to build CEBL cluster tools for
high-volume manufacturing. To
initiate a request for proposal, send a summary of
your requirements to
Contact us today.
Submit your Request for Proposal.