Headlines  
September 2016
eBeam Initiative presentation:
Embedding IoT Chip Security using eBeam Solutions
 
July 2016
Semiconductor Engineering Interview:
David Lam on IoT Security
 
June 2016
Reducing IC Manufacturing Cost While Enhancing IoT Security
 
November 2015
Semiconductor Engineering Interview:
Inside Multibeam E-beam lithography
 
May 2015
eBeam Initiative Interview:
David Lam, Perspectives on CEBL
 
April 2015
Multibeam Secures Two Patents
 
June 2014
From the eBeam Initiative:
Complementary E-Beam Lithography
 
   
 
 
A Fresh Approach to Electron Writing
 
   
 

Unlike conventional Electron-Beam Lithography (EBL) systems that employ a single complex e-beam column writing pixels, Multibeam takes a fresh approach in column design, system architecture, and writing strategy.

Multibeam's miniature columns have a streamlined design capable of writing patterns at very high resolution. Identical columns are assembled into an array. Each electron beam is individually controlled with high-speed electronics. Beam positions are automatically registered to the wafer for overlay accuracy. Operating simultaneously, the columns pattern critical wafer layers with low pattern density in less than 12 minutes or faster, depending on application. Cluster tools with multiple e-beam modules speed throughput for high-volume manufacturing. Single- or multi-module Multibeam systems can be inserted into existing manufacturing fabs running 200mm or 300mm wafers.

 

 

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