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Multibeam’s core invention is a multi-column e-beam
lithography “engine”, the MBXÔ
Engine, consisting of multiple individually controlled
all-electrostatic e-beam columns. The proprietary
electron optics technology, which eliminates all
magnetic fields, enables fast beam steering and blanking
and an extremely small column footprint (of less than
30mm x 30mm). Each e-beam column has its own electron
source and writes independently and in parallel, with
each column acting as a single-beam writer. Multibeam
has over 30 patents, 15 of which have been issued.
Multibeam has developed a family of MBXÔ
Engines. Each MBXÔ
Engine consists of either a 10-column linear array for
patterning or inspecting 300mm wafers (MBX-10), a
7-column array for 200mm wafers (MBX-7), or a 5-column
array for 150mm wafers or masks (MBX-5). For higher
throughput, Multibeam MBXÔ
Engines may incorporate multiple linear arrays into a
two-dimensional array spanning the entire wafer.
To boost throughput, each e-beam column includes
a thermal field emitter (TFE)
electron source and incorporates unique IP that shapes
beams while retaining high current density. High
current density reduces flash time, the time it takes
for resist to be exposed, enabling each Multibeam column
to print a feature in tens of nanoseconds.
A
mainfield deflector sequentially positions each e-beam
at the center of a subfield, while a subfield
deflector scans the beam within each subfield. To enable
high blanking rates, the e-beam column utilizes
multiple-deflection high-speed blankers which turn the
beam on and off to write each shape while maintaining
beam placement precision at the wafer. The
Multibeam MEBICÔ
has
the capability of patterning full wafers at throughputs
compatible with modern semiconductor manufacturing flows
for certain applications. |