Headlines  
June 2014
From The Whiteboard: David Lam
"A look at what’s missing in semiconductor lithography and what’s needed to finish the job."
Semiconductor Engineering
 
January 2014
Waiting for Next-Generation Lithography...
 
October 2013
Getting Direct on Litho
One-on-one with David Lam
 
July 2013
Slideshow: Lam Eyes Next $1B Opportunity
 
SPIE Photomask Technology
September 09
, 2013
Charting CEBL’s Role in Mainstream Semiconductor Lithography
Dr. David K. Lam
 
     
 
 
How CEBL Works
 
   
 

Multibeam’s CEBL technology achieves high throughput and resolution with a multi-column array of electrostatically controlled e-beams. Eliminating cumbersome electromagnetic control radically shrinks column footprints. Absence of magnetic fields (and hysteresis) enables e-beams to be deflected at very high speeds for alignment, blanking, shaping, focusing and positioning. While a mainfield deflector first positions the beam at a subfield; a subfield deflector then rapidly vector scans the beam to write patterns.

“Multibeam optimizes a single column before building an Array of identical columns. A module with a single column array is capable of patterning 5 wafers/hour. Multibeam collaborates with an established equipment manufacturer to build CEBL cluster tools for high-volume manufacturing”.

 

CEBL offers compelling advantages as each column is individually auto-calibrated and patterns wafers with high overlay accuracy. Vector scanning boosts throughput by skipping over areas without patterns. Each column is identical, leading to lower-cost manufacturing and higher reliability. Multibeam collaborates with an established equipment manufacturer to build CEBL cluster tools for high-volume manufacturing. To initiate a request for proposal, send a summary of your requirements to trigoli@multibeamcorp.com.



Contact us today. Submit your Request for Proposal.

   
       
 
 
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