Multibeam’s CEBL technology achieves high throughput and resolution with a multi-column array of electrostatically controlled e-beams. Eliminating cumbersome electromagnetic control radically shrinks column footprints. Absence of magnetic fields (and hysteresis) enables e-beams to be deflected at very high speeds for alignment, blanking, shaping, focusing and positioning. While a mainfield deflector first positions the beam at a subfield; a subfield deflector then rapidly vector scans the beam to write patterns.

“Multibeam optimizes a single column before building an Array of identical columns. A module with a single column array is capable of patterning 5 wafers/hour. Multibeam collaborates with an established equipment manufacturer to build CEBL cluster tools for high-volume manufacturing”.

CEBL offers compelling advantages as each column is individually auto-calibrated and patterns wafers with high overlay accuracy. Vector scanning boosts throughput by skipping over areas without patterns. Each column is identical, leading to lower-cost manufacturing and higher reliability. Multibeam collaborates with an established equipment manufacturer to build CEBL cluster tools for high-volume manufacturing. To initiate a request for proposal, send a summary of your requirements to trigoli@multibeamcorp.com.

Contact us today. Submit your Request for Proposal.