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Multibeam Accepts 3D InCites’ Advanced Technology Enablement Awards at IMAPS DPC 2024

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Multibeam President Ken MacWilliams attended the IMAPS Device Packaging Conference (DPC) in Arizona and joined fellow our 3D InCites community for the award ceremony.

It’s been a great honor to be recognized with the 2024 Advanced Technology Enablement Award. Multibeam is proud to be among leaders in community who are continuously driving new semiconductor manufacturing innovations, especially for advanced packaging applications.

Multibeam WINS 3D InCites’ Advanced Technology Enablement Awards

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Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.

Multibeam feature in Semiconductor Digest

Multibeam shortlisted as finalist for 3D InCites’ Advanced Technology Enablement Awards

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Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.

SkyWater Technology and Multibeam Corporation Form Partnership to Deploy Multibeam’s Innovative MEBL System

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SkyWater Technology and Multibeam Corporation Form Partnership to Deploy Multibeam’s Innovative MEBL System Advanced lithography technology to serve as a key enabler for SkyWater’s domestic foundry roadmap to 45 nm SANTA CLARA, CA|BLOOMINGTON, MN – November 18, 2020SkyWater Technology,the trusted technology realization partner, and Multibeam Corporation, the maskless lithography technology leader, today disclosed a partnership …

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Multibeam Unveils Major Initiative to Develop Full-Wafer, All-Maskless Patterning at 45nm and Larger Nodes on Its MEBL Production System

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Multibeam Unveils Major Initiative to Develop Full-Wafer, All-Maskless Patterning at 45nm and Larger Nodes on Its MEBL Production System $38 Million DoD Contract Awarded to Multibeam to Develop New MEBL Application SANTA CLARA, CA – September 10, 2020Multibeam Corporation todayconfirmed it has embarkedupon an ambitious project to apply its innovative Multicolumn E-Beam Lithography (MEBL) technology …

Multibeam Unveils Major Initiative to Develop Full-Wafer, All-Maskless Patterning at 45nm and Larger Nodes on Its MEBL Production System Read More »

Security Lithography

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Security Lithography MARCH 3RD, 2020 – BY: MARK LAPEDUS At the recent SPIE Advanced Lithography conference, Multibeam disclosed more details about its efforts to develop multi-beam direct-write lithography for chip security applications. David Lam, chief executive and chairman of Multibeam, described how multi-beam lithography can be used to help thwart IC counterfeiting and tampering in …

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