Newsroom
News, Press Releases and Upcoming events.
Multibeam Accepts 3D InCites’ Advanced Technology Enablement Awards at IMAPS DPC 2024
Multibeam President Ken MacWilliams attended the IMAPS Device Packaging Conference (DPC) in Arizona and joined fellow our 3D InCites community for the award ceremony.
It’s been a great honor to be recognized with the 2024 Advanced Technology Enablement Award. Multibeam is proud to be among leaders in community who are continuously driving new semiconductor manufacturing innovations, especially for advanced packaging applications.
Multibeam WINS 3D InCites’ Advanced Technology Enablement Awards
Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.
Multibeam shortlisted as finalist for 3D InCites’ Advanced Technology Enablement Awards
Multibeam has been selected as a finalist in the Advanced Technology Enablement Award category! The Advanced Technology Enablement Awards recognize efforts across the microelectronics supply chain that contribute to the advancement of the heterogeneous integration roadmap, including 3D packaging, interposer integration, fan-out wafer-level packaging, chiplet architectures, materials development, and full system integration.
Multibeam’s Feature in Semiconductor Digest Magazine
Multibeam Chairman & CEO Dr. David K. Lam shared some insights into what trends and emerging technologies & processes the semiconductor will likely see flourish in 2024. Check out his 2024 Outlook: Executive Viewpoint on page 23 of the November/December 2023 issue!
Multibeam’s Cover & Article with Chip Scale Review
A New Generation of E-Beam Lithography to Enable Packaging at the Leading Edge – by Dr. David K. Lam, and Dr. Ken MacWilliams | Chip Scale Review
SkyWater Technology and Multibeam Corporation Form Partnership to Deploy Multibeam’s Innovative MEBL System
SkyWater Technology and Multibeam Corporation Form Partnership to Deploy Multibeam’s Innovative MEBL System Advanced lithography technology to serve as a key enabler for SkyWater’s domestic