ADVANCED PACKAGING

Advanced packaging including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-packaging

Adaptive patterning, large fields, and unmatched resolutions for new packaging applications. Capable of volume or batch production of System in Package (SiP), MEMS & Sensor Packaging, Fan Out Packaging, and 2.5D/3D IC Packaging.
Enabling next generation interposers — Metaposers™.

Applications ADV PACKAGING - shutterstock_2152939163 Multibeam Licensed 220727-min 1
APPLICATIONS
SECURE CHIP ID -2
APPLICATIONS

Secure Chip ID

Powerful new technology in the never-ending fight against security threats

Security is a must in a world where counterfeiters abound. Secure Chip ID is the leading anti-counterfeit capability, capable of hard-coding unique information into each chip seamlessly during routine wafer fabrication flow. Physically patterning IDs that are buried deep within the processing helps to enable essential system level security. By ensuring the provenance of critical IC components, Multibeam avoids vulnerabilities related to conventional approaches.

Rapid Prototyping / High-Mix Production

A broad range of advanced customizable and innovative process technologies for growing markets

  • Rapid prototyping: Digital printing and maskless patterning enable rapid prototyping for faster first article delivery and system productization
  • Accelerate the path to production: Speed the development cycle for faster cycles of learning
  • High mix production enabled with customizable patterning
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APPLICATIONS
PHOTONICS 3 sin texto (1)
APPLICATIONS

Photonics

High performance, low loss, novel structures

  • Expand into multiple high growth photonics segments
  • Optical connections at the package
    and device level
  • Specialty applications for unique IoT requirements: medical diagnostic testing, optical biotechnology sensing, faster high resolution augmented reality …

YOUR DREAM

NO LONGER JUST FOR RESEARCH

Multibeam’s unique multicolumn e-beam technolgy brings the high precision of e-beam direct writing to  productivity levels that enable your applications

  • 100X more productive than conventional e-beam
  • 100X Depth of Focus range of optical lithography
  • 100X larger writing Field of View than optical lithography    
  • 10X more precision than laser direct
    write
  • Variety of substrate types, sizes, and shapes
APPLICATIONS