World’s First

High-Productivity Multicolumn E-Beam Lithography Platform

100X

Faster time to pattern

100X

Depth of focus range

>100X

More designs per wafer

Zero

Masks

Applications

Advanced Packaging

2.5D, 3D-IC, fan-out wafer-level packaging and system-in-packaging

Gratings

Photonics for Data Centers, AI/HPC, 5G/6G & LiDAR

Silicon Photonics

E-beam lithography enables nanoscale photonic and electronic components

Rapid Prototyping / High-Mix Production

Rapid Maskless Patterning, 100s of designs per wafer

Compound Semiconductor / Power Devices

Non-planar surfaces, 3D structures

Mems & Sensors

E-beam writes accurately on complex die topography

Secure Chip ID

Assured Chip Provenance

Enabling Innovative Chip Integration and Fabrication Capabilities for Next Generation

Advanced Packaging

Gratings

Silicon Photonics

Rapid Prototyping

Compound Semiconductor / Power Devices

Mems & Sensors

Secure Chip ID

Accelerating Chip Innovation

Multibeam partners with leading device makers to push the boundaries of what is possible in advanced IC production and accelerate chip innovation for a variety of rapidly growing applications.

Tapered Spiral

Spiral

Sequential lines

Thick sequential lines

Fine lines

Horizontal lines

Field of Vias

Vias

Multicolumn Electron Beam Lithography

Multibeam's High-Productivity EBL Platform

Multibeam leads the multicolumn e-beam lithography market with a platform that enables rapid prototyping and production of leading-edge semiconductors with fastest time-to-market advantages for special applications like advanced packaging, compound semiconductors, MEMS & sensors, photonics, secure chip ID, and more

Company

Multibeam leads with a breakthrough Multicolumn E-Beam Lithography solution for cost-effective production of leading-edge semiconductors and rapid time to market.